WET STATION
WET STATION is designed for chemical cleaning of wafers and glass substrates in semiconductor and display manufacturing. It removes process contaminants through immersion or spray treatment and supports a stable sequence from cleaning and rinsing to drying.
- Batch processes including pre-diffusion clean, post-etch clean, and stripping
- Chemical tank and DI water/chemical supply lines
- Individual bath control for dipping time, temperature, and process time
- Integrated exhaust, drainage, and waste-chemical handling
- Custom bath material, dimensions, and quantity for each process
Process & Features
Process Configuration
- Independent chemical-bath operation
- Optional heater, bubble, and rinse functions
- Continuous cleaning, rinsing, and drying sequence
Cleaning & Drying
- Removal of organic, metallic, and particle contamination
- Manual or automatic drying operation
- Uniform surface treatment for repeatable process performance
Specification
Typical Specifications · 200 mm Wet Station
| Process | Pre-Diffusion Clean, Post-Etch Clean, Stripping |
|---|---|
| Particle | ≤ 65 nm, ≤ 50 ea |
| E/R Uniformity | ≤ 5% |
| Productivity | Max. 420 WPH |
| Process Control | Individual bath control for immersion time, temperature and process time |
| Interface | Software & GUI |
| Customization | Custom system configuration for process requirements |